Manufacturability issues with double patterning for 50-nm half-pitch single damascene applications, using RELACS shrink and corresponding OPC

Op de Beeck, MaaikeMaaikeOp de BeeckVersluijs, JankoJankoVersluijsWiaux, VincentVincentWiauxVandeweyer, TomTomVandeweyerCiofi, IvanIvanCiofiStruyf, HerbertHerbertStruyfHendrickx, DirkDirkHendrickxVan Olmen, JanJanVan Olmen2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/12647Manufacturability issues with double patterning for 50-nm half-pitch single damascene applications, using RELACS shrink and corresponding OPCProceedings paper