Through-silicon via and die stacking technologies for microsystems-integration

Beyne, EricEricBeyneDe Moor, PietPietDe MoorRuythooren, WouterWouterRuythoorenLabie, RietRietLabieJourdain, AnneAnneJourdainTilmans, HarrieHarrieTilmansSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanSoussan, PhilippePhilippeSoussanSwinnen, BartBartSwinnenCartuyvels, RudiRudiCartuyvels2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/13389Through-silicon via and die stacking technologies for microsystems-integrationProceedings paper