Assessment of the feasibility of 'multiple chips-to-wafer' thermo-compression bonding using FEM

Okoro, ChukwudiChukwudiOkoroJourdain, AnneAnneJourdainVandevelde, BartBartVandeveldeSwinnen, BartBartSwinnenVandepitte, DirkDirkVandepitte2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14248Assessment of the feasibility of 'multiple chips-to-wafer' thermo-compression bonding using FEMProceedings paper