Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies

Vandevelde, BartBartVandeveldeOkoro, ChukwudiChukwudiOkoroGonzalez, MarioMarioGonzalezSwinnen, BartBartSwinnenBeyne, EricEricBeyne2021-10-172021-10-172008-04https://imec-publications.be/handle/20.500.12860/14711Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologiesProceedings paperwww.ieee.org