The bottom-up copper fill of Ø5μm × 40μm vias using 2-component model

Radisic, AlexAlexRadisicYang, LiuLiuYangDrijbooms, ChrisChrisDrijboomsBender, HugoHugoBender2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/21366The bottom-up copper fill of Ø5μm × 40μm vias using 2-component modelProceedings paperhttp://www.ecsdl.org/new_ECST