Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6+N2+H2

Li, H.H.LiHeyvaert, IlseIlseHeyvaertJin, S.S.JinLanckmans, FilipFilipLanckmansBender, HugoHugoBenderMaex, KarenKarenMaexFroyen, L.L.Froyen2021-10-012021-10-011998https://imec-publications.be/handle/20.500.12860/2721Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6+N2+H2Oral presentation