Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding

Huyghebaert, CedricCedricHuyghebaertVan Olmen, JanJanVan OlmenCivale, YannYannCivalePhommahaxay, AlainAlainPhommahaxayJourdain, AnneAnneJourdainSood, SumantSumantSoodFarrens, ShariShariFarrensSoussan, PhilippePhilippeSoussan2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/17298Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bondingProceedings paper