A quantitative adhesion study between contacting materials in Cu damascene structures

Lanckmans, FilipFilipLanckmansBrongersma, SywertSywertBrongersmaVarga, IstvanIstvanVargaPoortmans, JefJefPoortmansBender, HugoHugoBenderConard, ThierryThierryConardMaex, KarenKarenMaex2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6515A quantitative adhesion study between contacting materials in Cu damascene structuresJournal article