Filling of 80 nm structures using a novel copper oxide reduction and reflow approach

Carbonell, LaureLaureCarbonellPalmans, RogerRogerPalmansTravaly, YoussefYoussefTravalyBrongersma, SywertSywertBrongersmaMaex, KarenKarenMaex2021-10-152021-10-152004https://imec-publications.be/handle/20.500.12860/8652Filling of 80 nm structures using a novel copper oxide reduction and reflow approachOral presentation