Integration of 20nm half pitch single damascene copper trenches by spacer-defined double patterning (SDDP) on metal hard mask (MHM)

Siew, Yong KongYong KongSiewVersluijs, JankoJankoVersluijsKunnen, EddyEddyKunnenCiofi, IvanIvanCiofiAlaerts, WilfriedWilfriedAlaertsDekkers, HaroldHaroldDekkersVolders, HennyHennyVoldersSuhard, SamuelSamuelSuhardCockburn, AndrewAndrewCockburnSleeckx, ErikErikSleeckxVan Besien, ElsElsVan BesienStruyf, HerbertHerbertStruyfMaenhoudt, MireilleMireilleMaenhoudtNoori, AtifAtifNooriPadhi, DeeneshDeeneshPadhiShah, KavitaKavitaShahGravey, VirginieVirginieGraveyBeyer, GeraldGeraldBeyer2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/17984Integration of 20nm half pitch single damascene copper trenches by spacer-defined double patterning (SDDP) on metal hard mask (MHM)Proceedings paper