Optimizing the electrodeposition process for filling microvias with copper for 3D-stacked integrated circuits

Van Bavel, MiekeMiekeVan BavelLuhn, OleOleLuhnRadisic, AlexAlexRadisicRuythooren, WouterWouterRuythooren2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14602Optimizing the electrodeposition process for filling microvias with copper for 3D-stacked integrated circuitsJournal articlehttp://www.future-fab.com/documents.asp?d_ID=4546