Study of intermetallic compound evolution of pure Sn and SnAg alloy solder on single and multi-layer under-bump materials

Hussain, TassawarTassawarHussainDerakhshandeh, JaberJaberDerakhshandehCochet, TomTomCochetBeyne, EricEricBeyneHsu, JackJackHsuHe, DongmingDongmingHeDe Wolf, IngridIngridDe Wolf2025-04-162025-02-152025-04-162024979-8-3503-9037-72687-9700WOS:001340802800077https://imec-publications.be/handle/20.500.12860/45214Study of intermetallic compound evolution of pure Sn and SnAg alloy solder on single and multi-layer under-bump materialsProceedings paper10.1109/ESTC60143.2024.10712073979-8-3503-9036-0WOS:001340802800077