Scalability of RuTiN barriers deposited by plasma-enhanced atomic layer deposition for advanced interconnects

Swerts, JohanJohanSwertsSiew, Yong KongYong KongSiewVan Besien, ElsElsVan BesienBarbarin, YohanYohanBarbarinBoemmels, JuergenJuergenBoemmelsTokei, ZsoltZsoltTokeiVan Elshocht, SvenSvenVan Elshocht2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/23140Scalability of RuTiN barriers deposited by plasma-enhanced atomic layer deposition for advanced interconnectsMeeting abstract