Materials engineering for future interconnects: "catalyst-free" electroless Cu deposition on self-assembly monolayer alternative barriers

Armini, SilviaSilviaArminiWhelan, CarolineCarolineWhelan2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/13312Materials engineering for future interconnects: "catalyst-free" electroless Cu deposition on self-assembly monolayer alternative barriersMeeting abstract