La Manna, AntonioAntonioLa MannaRebibis, Kenneth JuneKenneth JuneRebibisGerets, CarineCarineGeretsBeyne, EricEricBeyne2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/19227Use of Wafer Applied Under Fill for 3D StackingProceedings paper