Ding, YouqiYouqiDingVarela Pedreira, OlallaOlallaVarela PedreiraLofrano, MelinaMelinaLofranoZahedmanesh, HoumanHoumanZahedmaneshChavez, T.T.ChavezFarr, H.H.FarrDe Wolf, IngridIngridDe WolfCroes, KristofKristofCroes2024-05-072023-07-152024-05-0720231541-7026WOS:001007431500069https://imec-publications.be/handle/20.500.12860/42160Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parametersProceedings paper10.1109/IRPS48203.2023.10117870978-1-6654-5672-2WOS:001007431500069TEMPERATUREELECTROMIGRATION