Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring

Suhard, SamuelSamuelSuhardIwasaki, AkihisaAkihisaIwasakiLiebens, MaartenMaartenLiebensStiers, KarenKarenStiersSlabbekoorn, JohnJohnSlabbekoornHolsteyns, FrankFrankHolsteyns2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/27363Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoringProceedings paperhttp://ieeexplore.ieee.org/document/7861453/