Influence of low-k dry etch chemistries on the properties of Copper and a TA-based diffusion barrier

Ernur, DidemDidemErnurIacopi, FrancescaFrancescaIacopiCarbonell, LaureLaureCarbonellStruyf, HerbertHerbertStruyfMaex, KarenKarenMaex2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/7556Influence of low-k dry etch chemistries on the properties of Copper and a TA-based diffusion barrierJournal article