Impact of Back-End-Of-Line architecture on Chip-Package-Interaction in advanced interconnects using shear microprobing and finite element simulations

Vanstreels, KrisKrisVanstreelsZahedmanesh, HoumanHoumanZahedmaneshGonzalez, MarioMarioGonzalez2021-10-262021-10-262018https://imec-publications.be/handle/20.500.12860/32157Impact of Back-End-Of-Line architecture on Chip-Package-Interaction in advanced interconnects using shear microprobing and finite element simulationsMeeting abstracthttp://mam2018.mdm.imm.cnr.it/MAM2018.pdf