A structured and scalable test access architecture for TSV-based 3D stacked ICs

Marinissen, Erik JanErik JanMarinissenVerbree, JoukeJoukeVerbreeKonijnenburg, MarioMarioKonijnenburg2021-10-182021-10-182010-04https://imec-publications.be/handle/20.500.12860/17588A structured and scalable test access architecture for TSV-based 3D stacked ICsProceedings paperhttp://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5469556