High spatial resolution measurements of thermo-mechanical stress effects in flip-chip package

Cherman, VladimirVladimirChermanLofrano, MelinaMelinaLofranoGonzalez, MarioMarioGonzalezVan der Plas, GeertGeertVan der PlasRebibis, Kenneth JuneKenneth JuneRebibisBeyne, EricEricBeyne2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/32702High spatial resolution measurements of thermo-mechanical stress effects in flip-chip packageProceedings paper