Electrochemical deposition of Sn-Cu alloys for applications in 3D stacking in microelectronics industry

Inoue, FumihiroFumihiroInoueEl-Mekki, ZaidZaidEl-MekkiStruyf, HerbertHerbertStruyfHou, LinLinHouDerakhshandeh, JaberJaberDerakhshandehBeyne, EricEricBeyneRadisic, AlexAlexRadisicHsia, Chih-HaoChih-HaoHsiaChang, IrisIrisChangKutner, ElisabethElisabethKutnerFluegel, AlexanderAlexanderFluegelArnold, MarcoMarcoArnold2021-10-282021-10-282020https://imec-publications.be/handle/20.500.12860/35306Electrochemical deposition of Sn-Cu alloys for applications in 3D stacking in microelectronics industryMeeting abstracthttps://iopscience.iop.org/article/10.1149/MA2020-01201235mtgabs#