Copper seed layer scaling for advanced interconnects: extendibility of I-PVD

Tokei, ZsoltZsoltTokeiDemuynck, StevenStevenDemuynckVervoort, IwanIwanVervoortMebarki, BencherkiBencherkiMebarkiMandrekar, T.T.MandrekarGuggilla, S.S.GuggillaMaex, KarenKarenMaex2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/8217Copper seed layer scaling for advanced interconnects: extendibility of I-PVDProceedings paper