Stackable memory of 3D chip integration for mobile applications

Gu, S.Q.S.Q.GuMarchal, PolPolMarchalFacchini, MarcoMarcoFacchiniWang, F.F.WangSuh, M.M.SuhLisk, D.D.LiskNowak, M.M.Nowak2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/13821Stackable memory of 3D chip integration for mobile applicationsProceedings paper