Duval, FabriceFabriceDuvalPodpod, ArnitaArnitaPodpodSalahouelhadj, AbdellahAbdellahSalahouelhadjPhommahaxay, AlainAlainPhommahaxayBertheau, JulienJulienBertheauRebibis, Kenneth JuneKenneth JuneRebibisSleeckx, ErikErikSleeckxBeyne, EricEricBeyne2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/30661Ultra-low warpage epoxy mold compound for fan-out wafer level package applicationsProceedings paperhttps://www.minalogic.com/sites/default/files/flyer_minapad_2018.pdf