A highly reliable 1.4μm pitch via-last TSV module for wafer-to-wafer hybrid bonded 3D-SOC systems

Van Huylenbroeck, StefaanStefaanVan HuylenbroeckDe Vos, JoeriJoeriDe VosEl-Mekki, ZaidZaidEl-MekkiJamieson, GeraldineGeraldineJamiesonTutunjyan, NinaNinaTutunjyanMuga, KarthikKarthikMugaStucchi, MicheleMicheleStucchiMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/34244A highly reliable 1.4μm pitch via-last TSV module for wafer-to-wafer hybrid bonded 3D-SOC systemsProceedings paperhttps://ieeexplore.ieee.org/document/8811243