Enabling UTBB Strained SOI Platform for Co-integration of Logic and RF: Implant-Induced Strain Relaxation and Comb-like Device Architecture

Sun, ChenChenSunLiang, JieJieLiangXu, HaiwenHaiwenXuKong, EugeneEugeneKongNguyen, Bich-YenBich-YenNguyenVandooren, AnneAnneVandoorenSchwarzenbach, WalterWalterSchwarzenbachMaleville, ChristopheChristopheMalevilleBarral, VincentVincentBarralBerthelon, RemyRemyBerthelonWeber, OlivierOlivierWeberArnaud, FranckFranckArnaudThean, Aaron V. Y.Aaron V. Y.TheanGong, XiaoXiaoGong2022-01-272021-11-022022-01-272022-01-2720200743-1562WOS:000668063000057https://imec-publications.be/handle/20.500.12860/37756Enabling UTBB Strained SOI Platform for Co-integration of Logic and RF: Implant-Induced Strain Relaxation and Comb-like Device ArchitectureProceedings paper978-1-7281-6460-1WOS:000668063000057