Correlation between barrier integrity and TDDB performance of copper porous low-k interconnects

Tokei, ZsoltZsoltTokeiPatz, MatthiasMatthiasPatzSchmidt, MichaelMichaelSchmidtIacopi, FrancescaFrancescaIacopiDemuynck, StevenStevenDemuynckMaex, KarenKarenMaex2021-10-152021-10-152004https://imec-publications.be/handle/20.500.12860/9685Correlation between barrier integrity and TDDB performance of copper porous low-k interconnectsJournal article