Cu passivation for integration of gap-filling ultralow-k dielectrics

Zhang, LipingLipingZhangde Marneffe, Jean-FrancoisJean-Francoisde MarneffeLesniewska, AlicjaAlicjaLesniewskaVerdonck, PatrickPatrickVerdonckHeylen, NancyNancyHeylenMurdoch, GayleGayleMurdochCroes, KristofKristofCroesBoemmels, JuergenJuergenBoemmelsTokei, ZsoltZsoltTokeiDe Gendt, StefanStefanDe GendtBaklanov, MikhailMikhailBaklanov2021-10-232021-10-2320160003-6951https://imec-publications.be/handle/20.500.12860/27661Cu passivation for integration of gap-filling ultralow-k dielectricsJournal articlehttp://scitation.aip.org/content/aip/journal/apl/109/23/10.1063/1.4971774