Electromigration-induced drift in damascene and plasma-etched Al(Cu). I: Kinetics of Cu depletion in polycrystalline interconnects

Proost, JorisJorisProostWitvrouw, AnnAnnWitvrouwMaex, KarenKarenMaexD'Haen, JanJanD'HaenCosemans, P.P.Cosemans2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4681Electromigration-induced drift in damascene and plasma-etched Al(Cu). I: Kinetics of Cu depletion in polycrystalline interconnectsJournal article