Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed

Armini, SilviaSilviaArminiEl-Mekki, ZaidZaidEl-MekkiVandersmissen, KevinKevinVandersmissenPhilipsen, HaroldHaroldPhilipsenRodet, SimonSimonRodetHonore, MiaMiaHonoreRadisic, AlexAlexRadisicCivale, YannYannCivaleBeyne, EricEricBeyneLeunissen, PeterPeterLeunissen2021-10-192021-10-1920110013-4651https://imec-publications.be/handle/20.500.12860/18488Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seedJournal article