Yang, LiuLiuYangMarchal, WouterWouterMarchalRadisic, AlexAlexRadisicDeconinck, JohanJohanDeconinckVereecken, PhilippePhilippeVereecken2021-10-212021-10-212013-03https://imec-publications.be/handle/20.500.12860/23418Role of oxygen and cuprous ions in copper electroplatingMeeting abstract