Priyabadini, SwarnakamalSwarnakamalPriyabadiniSterken, TomTomSterkenVan Hoorebeke, LucLucVan HoorebekeVanfleteren, JanJanVanfleteren2021-10-212021-10-212013-071521-3331https://imec-publications.be/handle/20.500.12860/229573D stacking of ultra-thin chip packages: an innovative packaging and interconnection technologyJournal articlehttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6410397&queryText%3D3D+stacking+of+ultra-thin+chip+packages%3A+an