Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages

Ivankovic, AndrejAndrejIvankovicVanstreels, KrisKrisVanstreelsVanderstraeten, DanielDanielVanderstraetenBrizar, GuyGuyBrizarGillon, RenaudRenaudGillonBlansaer, EddyEddyBlansaerVandevelde, BartBartVandevelde2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/17310Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packagesProceedings paper