Identification of key factors to reduce stress induced during 3D IC's assembly

Lofrano, MelinaMelinaLofranoGonzalez, MarioMarioGonzalezCherman, VladimirVladimirCherman2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/26924Identification of key factors to reduce stress induced during 3D IC's assemblyProceedings paperhttp://ieeexplore.ieee.org/document/7764699