Development of wafer-level adhesive bonding for fine-pitch 3-D connections

Bertheau, JulienJulienBertheauInoue, FumihiroFumihiroInoueIacovo, SerenaSerenaIacovoPeng, LanLanPengDerakhshandeh, JaberJaberDerakhshandehBeyne, EricEricBeyne2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/27839Development of wafer-level adhesive bonding for fine-pitch 3-D connectionsMeeting abstract