Microstructural evolution of Cu interconnect under AC, pulsed DC and DC current stress

Biesemans, LeenLeenBiesemansVanstreels, KrisKrisVanstreelsBrongersma, SywertSywertBrongersmaD'Haen, JanJanD'HaenDe Ceuninck, WardWardDe CeuninckD'Olieslaeger, MarcMarcD'Olieslaeger2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/11746Microstructural evolution of Cu interconnect under AC, pulsed DC and DC current stressProceedings paper