3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps

Guo, WeiWeiGuoVan der Plas, GeertGeertVan der PlasIvankovic, AndrejAndrejIvankovicEneman, GeertGeertEnemanCherman, VladimirVladimirChermanDe Wachter, BartBartDe WachterMercha, AbdelkarimAbdelkarimMerchaGonzalez, MarioMarioGonzalezCivale, YannYannCivaleRedolfi, AugustoAugustoRedolfiBuisson, ThibaultThibaultBuissonJourdain, AnneAnneJourdainVandevelde, BartBartVandeveldeRebibis, Kenneth JuneKenneth JuneRebibisDe Wolf, IngridIngridDe WolfLa Manna, AntonioAntonioLa MannaBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneSwinnen, BartBartSwinnen2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/207643D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumpsProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6232855