Alavi, OmidOmidAlaviDe Ceuninck, WardWardDe CeuninckDaenen, MichaëlMichaëlDaenen2024-12-182024-06-232024-12-1820242079-9292WOS:001246836600001https://imec-publications.be/handle/20.500.12860/44075Impact of Solder Voids on IGBT Thermal Behavior: A Multi-Methodological ApproachJournal article10.3390/electronics13112188WOS:001246836600001MODELCLASSIFICATIONPREDICTIONFATIGUEMODULESRESISTANCENETWORKSINVERTERMOSFETSTIME