Extremely low force debonding of thinned CMOS substrate by laser release of a temporary bond material

Phommahaxay, AlainAlainPhommahaxayPotoms, GoedeleGoedelePotomsVerbinnen, GreetGreetVerbinnenSleeckx, ErikErikSleeckxBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneGuerrero, AliceAliceGuerreroDonghun, BaiBaiDonghunXiao, LiuLiuXiaoYess, KimKimYessArnold, KimKimArnoldSpiess, WalterWalterSpiessGriesbach, TimTimGriesbachRapps, ThomasThomasRappsLutter, StefanStefanLutter2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/27141Extremely low force debonding of thinned CMOS substrate by laser release of a temporary bond materialProceedings paperhttp://ieeexplore.ieee.org/document/7545649/?arnumber=7545649