Alavi, OmidOmidAlaviDe Ceuninck, WardWardDe CeuninckDaenen, MichaëlMichaëlDaenen2023-05-252023-01-092023-05-2520220026-2714WOS:000897681400003https://imec-publications.be/handle/20.500.12860/40949Optimized selection of materials for IGBT module packagingJournal article10.1016/j.microrel.2022.114736WOS:000897681400003THERMODYNAMIC PROPERTIESFAILURE MODES