Stoukatch, SergueiSergueiStoukatchMeng, Ho HongHo HongMengVaesen, KristofKristofVaesenWebers, TomasTomasWebersCarchon, GeertGeertCarchonDe Raedt, WalterWalterDe RaedtBeyne, EricEricBeyneDe Baets, JohanJohanDe BaetsNaem, AbdallaAbdallaNaemPoddar, AnindyaAnindyaPoddar2026-07-242026-07-2420033067-8889https://imec-publications.be/handle/20.500.12860/59962The major trend in the packaging industry is to satisfy the needs for high-performance, miniaturized, portable and space-efficient products for mobile equipment, autonomous and wireless telecommunication applications. Since it is becoming more and more difficult to achieve higher density in two dimensions, further increased system density can be realized by growth into the third dimension (Z-axis)Miniaturization Using 3-D Stack Structure for SIP ApplicationsJournal article10.37665/smnrkfh31672