Comparison of x-ray diffraction, wafer curvature and Raman spectroscopy to evaluate the stress evolution in Copper TSV's

Wilson, ChrisChrisWilsonDe Wolf, IngridIngridDe WolfVandevelde, BartBartVandeveldeDe Messemaeker, JokeJokeDe MessemaekerAblett, James M.James M.AblettRedolfi, AugustoAugustoRedolfiSimons, VeerleVeerleSimonsBeyne, EricEricBeyneCroes, KristofKristofCroes2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/21850Comparison of x-ray diffraction, wafer curvature and Raman spectroscopy to evaluate the stress evolution in Copper TSV'sProceedings paper