300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications

Jourdain, AnneAnneJourdainBuisson, ThibaultThibaultBuissonPhommahaxay, AlainAlainPhommahaxayPrivett, MarcMarcPrivettWallace, DanielDanielWallaceSood, SumantSumantSoodBisson, PeterPeterBissonBeyne, EricEricBeyneTravaly, YoussefYoussefTravalySwinnen, BartBartSwinnen2021-10-182021-10-182010-11https://imec-publications.be/handle/20.500.12860/17327300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applicationsMeeting abstract