Novel seed layer formation using direct electroless copper deposition on ALD-Ru layer for high aspect ratio TSV

Inoue, FumihiroFumihiroInouePhilipsen, HaroldHaroldPhilipsenRadisic, AlexAlexRadisicArmini, SilviaSilviaArminiCivale, YannYannCivaleLeunissen, PeterPeterLeunissenShingubara, ShosoShosoShingubara2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/20847Novel seed layer formation using direct electroless copper deposition on ALD-Ru layer for high aspect ratio TSVProceedings paperhttp://dx.doi.org/10.1109/IITC.2012.6251660