Improving The Wafer Thinning Flow Robustness For 2.5D & 3D Applications

Jedidi, NaderNaderJedidiKennes, KoenKoenKennesPhommahaxay, AlainAlainPhommahaxayGuerrero, AliceAliceGuerreroBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2025-04-162025-02-152025-04-162024979-8-3503-9037-72687-9700WOS:001340802800095https://imec-publications.be/handle/20.500.12860/45219Improving The Wafer Thinning Flow Robustness For 2.5D & 3D ApplicationsProceedings paper10.1109/ESTC60143.2024.10712091979-8-3503-9036-0WOS:001340802800095