Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding

De Messemaeker, JokeJokeDe MessemaekerVan Sever, KoenKoenVan SeverTsau, Yan WenYan WenTsauZhang, BoyaoBoyaoZhangCroes, KristofKristofCroesBeyne, EricEricBeyne2025-04-102024-12-072025-04-102024979-8-3503-7599-20569-5503WOS:001260983500304https://imec-publications.be/handle/20.500.12860/44944Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer BondingProceedings paper10.1109/ECTC51529.2024.00310979-8-3503-7598-5WOS:001260983500304