On the thermal stability of physically-vapor-deposited diffusion barriers in 3D through-silicon vias during IC processing

Civale, YannYannCivaleCroes, KristofKristofCroesMiyamori, YuichiYuichiMiyamoriVelenis, DimitriosDimitriosVelenisRedolfi, AugustoAugustoRedolfiThangaraju, SarasvathiSarasvathiThangarajuVan Ammel, AnnemieAnnemieVan AmmelCherman, VladimirVladimirChermanVan der Plas, GeertGeertVan der PlasCockburn, AndrewAndrewCockburnGravey, VirginieVirginieGraveyKumar, NirajanNirajanKumarCao, ZhitaoZhitaoCaoTravaly, YoussefYoussefTravalyTokei, ZsoltZsoltTokeiBeyne, EricEricBeyneSwinnen, BartBartSwinnen2021-10-212021-10-2120130167-9317https://imec-publications.be/handle/20.500.12860/22152On the thermal stability of physically-vapor-deposited diffusion barriers in 3D through-silicon vias during IC processingJournal article