Optimal choice of the FEM damage volumes for estimation of the solder joint reliability for electronic package assemblies

Vandevelde, BartBartVandeveldeGonzalez, MarioMarioGonzalezBeyne, EricEricBeyneZhang, G.Q.G.Q.ZhangCaers, J.J.Caers2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/8335Optimal choice of the FEM damage volumes for estimation of the solder joint reliability for electronic package assembliesProceedings paper