Stress-induced lift-off method for KERF-loss-free wafering of ultra-thin (~50 μm) crystalline Si wafers

Dross, FredericFredericDrossMilhe, A.A.MilheRobbelein, JoJoRobbeleinGordon, IvanIvanGordonBouchard, P.O.P.O.BouchardBeaucarne, GuyGuyBeaucarnePoortmans, JefJefPoortmans2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/13675Stress-induced lift-off method for KERF-loss-free wafering of ultra-thin (~50 μm) crystalline Si wafersProceedings paper